"Secomea has saved us time and money, and brought peace of mind by giving selected staff a secure way to remotely connect to our system during critical times.
- Karyn Highfill, Control Systems Specialist at City of Springfield
Secomea Inc. invites to you join us at PACK EXPO International.
Booth No:
N-4604
Event Date:
October 14-17, 2018
Address:
MCCORMICK PLACE
2301 S King Dr,
Chicago, IL 60616
USA
Register NOW for Free:
Just click the link: https://www.packexpointernational.com/ or https://www.hcpechicago.com/ and select “Register”, top right corner of the page.
Enter our PACK EXPO International Comp Code, 41U41 during the registration process and the registration fee will be waived prior to your checkout. This PACK EXPO offer expires on October 13, 2018.
We look forward to seeing you at our Booth N-4604.
To read more about the event here: https://www.hcpechicago.com/.
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