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PackExpo 2018 – Chicago, IL US

14 Oct 2018 - 17 Oct 2018

Pack Expo is a biennially held trade fair for packaging technology. Pack Expo exhibitors showcase the latest developments in packaging machinery, converting machinery, materials, packages, containers and components. The industries´top technicians and engineers are present to provide packaging solutions for all needs.

The Pack Expo will take place on 4 days from Sunday, 14. October to Wednesday, 17. October 2018 in Chicago.

Booth: TBA

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Haas-Meincke, one of the world’s largest manufacturers of baking equipment, bought their first Secomea SiteManager in 2008.
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