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PackExpo 2018 – Chicago, IL, USA

14 Oct 2018 - 17 Oct 2018

Secomea Inc. invites to you join us at PACK EXPO International.

Booth No:

N-4604

Event Date:

October 14-17, 2018

Address:

MCCORMICK PLACE

2301 S King Dr,

Chicago, IL 60616

USA

Register NOW for Free:

Just click the link: https://www.packexpointernational.com/ or https://www.hcpechicago.com/ and select “Register”, top right corner of the page.

Enter our PACK EXPO International Comp Code, 41U41 during the registration process and the registration fee will be waived prior to your checkout. This PACK EXPO offer expires on October 13, 2018.

We look forward to seeing you at our Booth N-4604.

To read more about the event here: https://www.hcpechicago.com/.

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